The new High Bandwidth Memory is the industry's first to deliver 2.4 gigabits-per-second (Gbps) data transfer speed per pin, and is aimed at the supercomputing and the graphics card market.
Created to replace Graphics Double Data Rate (GDDR) memory in graphics and accelerator applications, High-Bandwidth Memory reduces the distance between the RAM and the processor by placing both on an interposer layer above the integrated circuit package substrate.
While I am a bit unsure of the "Aquabolt" name, there is no doubt that HBM is finding its place in the industry, and now HBM2 is in production by Samsung. As for bandwidth, we're looking at around 300MBps per pin, which on a 1024-bit memory bus should provide around 307GB/sec per package, times 4 bringing us to a insane 1.2TB/sec of memory bandwidth. The South Korean tech giant hopes to triple its share in the HBM2 market thanks to ramped up production and its new generation product.More news: Ex-BHS boss Chappell found guilty following TPR prosecution
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'With our production of the first 2.4Gbps 8GB HBM2 we are further strengthening our technology leadership and market competitiveness, ' crowed Jaesoo Han, executive vice president of Samsung's Memory Sales & Marketing division. Samsung's figures for the Aquabolt are nothing but impressive: 307 GBps data bandwidth for a single package and 1.2 TBps in a system that uses four 2nd-generation HBM2 packages. Moreover, Samsung will continue to offer leading-edge HBM2 solutions, to succeed its 1st-generation HBM2, Flarebolt™, and its 2nd-generation, Aquabolt, as it further expands the market over the next several years. Samsung used new technologies within their TSV design, as well as tweaks to thermal control.
A single 8GB HBM2 package, for example, consists of eight 8Gb HBM2 dies that are vertically interconnected using over 5,000 TSVs per die. Furthermore, the firm's engineers implemented a design with an increased number of thermal bumps between the dies - providing greater thermal control.